Hybrid bonding
2022年7月20日—比起使用銲錫Microbumps,CuHybridBonding能提升200倍的接點密度,而且每個訊號傳遞所需的能量降低至三分之一以下,非常令人驚艷。圖七Intel異質 ...,HybridBonding.HeterogeneousIntegrationhelpssemiconductorcompaniescombinechipletsbasedonavari...
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2022年8月18日—Hybridbondingisapermanentbondthatcombinesadielectricbond(SiOx)withembeddedmetal(Cu)toforminterconnections.It'sbecomeknown ...
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